Panasonic's new semiconductor packaging material, R-1515V, enables both low package warpage and high assembly-level reliability. This new material has very low thermal expansion properties which reduces the warping of the substrate during the packaging process. Its optimized mechanical properties lower the residual stress on solder joints, created during reflow assembly, to improve reliability.
Suitable for IoT, V2X, 5G and other leading-edge technologies.
Panasonic's new substrate material improves package-level reliability by reducing warpage during packaging (mounting chips on the IC substrate followed by an encapsulation process). The coefficient of thermal expansion (CTE) of the new substrate material is much closer to that of silicon IC chips, reducing warpage caused by the thermal excursions during packaging processes.
During the reflow assembly process, when the semiconductor package is assembled onto the motherboard, the material lowers stress imparted to the solder balls - improving assembly-level reliability. The new material features excellent thickness tolerances, ensuring stable junctions between the substrate and the IC chips. This modified flexibility and buffering properties alleviate the stress on solder balls, improving the assembly-level reliability.
Flip-Chip Ball Grid Array (FC-BGA) packages such as:
The product is currently being presented at the 2021 IEEE 71st Electronic Components and Technology Conference (from June 1 to July 4, 2021).