For Flip Chip Ball Grid Array (fcBGA) applications, Panasonic offers materials with excellent CTE, low stress performance and high heat resistance properties
This enables reliable manufacturing and optimal field performance for both first and second level packaging requirements.
FC-BGA
Part number list
Results 5
| Part No. | Datasheet | Tg (DMA) (°C) | Dk at 1 GHz | Df at 1 GHz | CTE-X, | CTE α1 Y-axis: Test Method Internal; Condition A (ppm/℃) | Flexural Modulus: Test method JIS C 6481; Condition 25℃ (GPa) | Flexural Modulus: Test method JIS C 6481; Condition 250℃ (GPa) | Peel Strength 1/3 oz (12μm): Test method IPC-TM-650 2.4.8; Condition A (kN/m) | Thickness Line-up (mm) |
|---|---|---|---|---|---|---|---|---|---|---|
250-260 | 4.4 | 0.015 | 4-6 | 4-6 | 32-34 | |||||
250-260 | 4.6 | 0.015 | 7-8 | 7-8 | 28-30 | |||||
260 | 4.4 | 0.016 | 3-5 | 3-5 | 30 | 14 | 0.6 | |||
205 | 12 | 12 | 4.8 | 0.015 | 27 | 10 | 0.9 | 0.10~0.8 | ||
250 | 9 | 9 | 4.8 | 0.015 | 35 | 21 | 0.9 | 0.20~0.8 |
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