Panasonic's advanced ultra-low transmission loss and low CTE substrate materials offer reliable signal performance at high frequency and elevated temperature/humidity
These properties enable the stable operation of Semiconductor devices that process large volumes of data at high speed. The warpage performance of Panasonic substrates is significantly lower than conventional materials which improve manufacturing yields.
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| Part No. | Datasheet | Tg (DMA) (°C) | Dk at 1 GHz | Df at 1 GHz | CTE-X, | CTE α1 Y-axis: Test Method Internal; Condition A (ppm/℃) | Flexural Modulus: Test method JIS C 6481; Condition 25℃ (GPa) | Flexural Modulus: Test method JIS C 6481; Condition 250℃ (GPa) | Peel Strength 1/3 oz (12μm): Test method IPC-TM-650 2.4.8; Condition A (kN/m) | Thickness Line-up (mm) |
|---|---|---|---|---|---|---|---|---|---|---|
230 | 10 | 10 | 4.1 | 0.002 | 27 | - | 0.6 | 0.04~0.4 | ||
230 | 10 | 10 | 3.6 | 0.002 | 23 | - | 0.6 | 0.04~0.4 |
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