CSP & FC-CSP

CSP & FC-CSP materials are ultra-thin, enabling thin IC package designs for space-constrained applications

The low CTE property, combined with Panasonic low-stress technology, means reduced warpage which ultimately yields higher operational reliability.

Part Number List

Results 5
Models table for series CSP & FC-CSP
Part No.DatasheetTg (DMA) (°C)Dk at 1 GHzDf at 1 GHzCTE-X, CTE α1 Y-axis: Test Method Internal; Condition A (ppm/℃)Flexural Modulus: Test method JIS C 6481; Condition 25℃ (GPa)Flexural Modulus: Test method JIS C 6481; Condition 250℃ (GPa)Peel Strength 1/3 oz (12μm): Test method IPC-TM-650 2.4.8; Condition A (kN/m)Thickness Line-up (mm)
270
4.7
0.011
9
9
33
18
0.9
0.04~0.2
270
4.3
0.015
4.3
3-5
19
5-8
0.6
0.04~0.2
270
4.5
0.015
5-7
5-7
16
7-10
0.6
0.04~0.2
220-240
4.2
0.008
4-6
4-6
28
-
0.7
0.03-0.2
220-240
4.4
0.008
6-8
6-8
24
-
0.7
0.03-0.2

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