R-G515S/R-G510S

Specifications

Specifications table for model R-G515S/R-G510S
ItemPerformance characteristics
Tg (DMA) (°C)220-240
Dk at 1 GHz4.2
Df at 1 GHz0.008
CTE-X, <Tg (ppm/℃)4-6
CTE α1 Y-axis: Test Method Internal; Condition A (ppm/℃)4-6
Flexural Modulus: Test method JIS C 6481; Condition 25℃ (GPa)28
Flexural Modulus: Test method JIS C 6481; Condition 250℃ (GPa)-
Peel Strength 1/3 oz (12μm): Test method IPC-TM-650 2.4.8; Condition A (kN/m)0.7
Thickness Line-up (mm)0.03-0.2

Stock check

Model image for R-G515S/R-G510S

R-G515S/R-G510S

What's New

Stay up to date

View All
New Semiconductor Substrate Material, R-1515V, Improves Assembly-Level Reliability
Aug 1, 2024

New Semiconductor Substrate Material, R-1515V, Improves Assembly-Level Reliability

IC Packaging Materials
Introducing Panasonic IC Packaging Materials
Sep 15, 2020

Introducing Panasonic IC Packaging Materials

IC Packaging Materials
Introducing the Electronic Materials Product Line
Aug 27, 2020

Introducing the Electronic Materials Product Line

Electronic Materials
Latest Videos

Playlist

Thumbnail for Panasonic LEXCM: Introduction to EMC Technology

Panasonic LEXCM: Introduction to EMC Technology

Thumbnail for Introduction to MUF Technology

Introduction to MUF Technology