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Wireless Connectivity

PAN1326C2 Series Bluetooth® 5.1 Multi Mode Wireless Connectivity RF Module and Evaluation Kit

FCC Listed Multi Mode Bluetooth® Classic and Bluetooth 5.1 Low Energy RF Module Host Controlled Interface (HCI) RF Module With TI’s CC2564C Core Integrated Circuit

Panasonic’s New FCC Listed PAN1326C2 Series Host Controlled Interface (HCI) Bluetooth RF Module brings Texas Instrument’s seventh generation Bluetooth core integrated circuit, the CC2564C, to an easy-to -use Module format. The New PAN1326C2 is Bluetooth® 5.1 compliant and offers best-in-class RF performance. Panasonic’s tiny footprint technology has produced a Module of only 85.5mm². The PAN1326C2 is designed to accommodate PCBs pad pitch of 1.3mm and as little as two layers for easy implementation and manufacturing. This Module has been designed to be 100% pin compatible with previous generations of Texas Instruments based Bluetooth HCI Modules.

The NEW PAN1326C2 Evaluation Kit is an all-inclusive and comprehensive Evaluation Kit consisting of one PAN1326C2 Daughterboard (ETU) for TI’s Development Board and one TI Adapter Board.

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