Specification

Specifications table for model AXF463500
ItemPerformance characteristics
Socket/<br>HeaderHeader
Number of Pins6
Mated Height (mm)0.8mm
Family Name (Head of Product No.)AXF4
TypeBOARD-TO-FPC
ApplicationsSmartphones, Tablet PCs, Mobile devices
Soldering Terminalswith
Positioning Bosseswithout
Body Length (mm)3.76
Body Height (mm)0.65
Short Width 1.80
Recommended PC Board Pattern Width (mm)2.20
Molded Portion Material LCP resin (UL94V-0)
Contact and Post MaterialCopper alloy
Surface Treatment Material Base: Ni plating Surface: Au plating
Rated Current3.0A/pin contact (Power terminal)
0.3A/pin contact (Signal terminal)
Insulation Resistance (Min. M&Omega;)(Initial)1000
Dielectric Strength150V AC for 1min.
Contact Resistance (M&Omega: Max.)Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Insertion and Removal Life (Times)Mechanical life: 30 times
Contact resistance:
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Composite removal force: Min. 7N
Soldering Heat ResistanceThe initial specification must be satisfied electrically and mechanically
Packing QuantityEMBOSSED TAPE AND PLASTIC REEL
Packing Quantity; Inner Carton (Pcs.) 15,000 pieces (1-reel)
Packing Quantity; Outer Carton (Pcs.)30,000 pieces
Piece Type2 Pieces type (Header)

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