Part Number List

Results 32
Models table for series A35P(0.35mm pitch)
Part No.DatasheetSocket/HeaderNumber of PinsMated Height (mm)Family Name (Head of Product No.)TypeApplicationsTerminal Pitch (mm)Soldering TerminalsPositioning BossesBody Length (mm)Body Height (mm)Short Width Recommended PC Board Pattern Width (mm)Molded Portion Material Contact and Post MaterialSurface Treatment Material Rated CurrentInsulation Resistance (Min. MΩ)(Initial)Dielectric StrengthContact Resistance (M&Omega: Max.)Insertion and Removal Life (Times)Packing QuantityPacking Quantity; Inner Carton (Pcs.) Packing Quantity; Outer Carton (Pcs.)
Socket
100
0.8mm
AXF5
BOARD-TO-FPC
DSC, Mobile devices
0.35
with
without
19.85
0.77
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
1.5 A/pin contact x 4 pin contacts or
1.25 A/pin contact x 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
1000
150V AC for 1min.
30
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
10
0.8mm
AXF6
BOARD-TO-FPC
DSC, Mobile devices
0.35
with
without
3.40
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
1.5 A/pin contact x 4 pin contacts or
1.25 A/pin contact x 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
1000
150V AC for 1min.
30
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
54
0.8mm
AXF6
BOARD-TO-FPC
DSC, Mobile devices
0.35
with
without
11.10
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
1.5 A/pin contact x 4 pin contacts or
1.25 A/pin contact x 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
1000
150V AC for 1min.
30
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
60
0.8mm
AXF6
BOARD-TO-FPC
DSC, Mobile devices
0.35
with
without
12.15
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
1.5 A/pin contact x 4 pin contacts or
1.25 A/pin contact x 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
1000
150V AC for 1min.
30
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
30
0.8mm
AXF6
BOARD-TO-FPC
DSC, Mobile devices
0.35
with
without
6.90
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
1.5 A/pin contact x 4 pin contacts or
1.25 A/pin contact x 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
1000
150V AC for 1min.
30
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Socket
12
0.8mm
AXF5
BOARD-TO-FPC
DSC, Mobile devices
0.35
with
without
4.45
0.77
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
1.5 A/pin contact x 4 pin contacts or
1.25 A/pin contact x 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
1000
150V AC for 1min.
30
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Socket
54
0.8mm
AXF5
BOARD-TO-FPC
DSC, Mobile devices
0.35
with
without
11.80
0.77
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
1.5 A/pin contact x 4 pin contacts or
1.25 A/pin contact x 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
1000
150V AC for 1min.
30
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Socket
16
0.8mm
AXF5
BOARD-TO-FPC
DSC, Mobile devices
0.35
with
without
5.15
0.77
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
1.5 A/pin contact x 4 pin contacts or
1.25 A/pin contact x 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
1000
150V AC for 1min.
30
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
34
0.8mm
AXF6
BOARD-TO-FPC
DSC, Mobile devices
0.35
with
without
7.60
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
1.5 A/pin contact x 4 pin contacts or
1.25 A/pin contact x 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
1000
150V AC for 1min.
30
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
Header
40
0.8mm
AXF6
BOARD-TO-FPC
DSC, Mobile devices
0.35
with
without
8.65
0.65
2.00
2.40
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
1.5 A/pin contact x 4 pin contacts or
1.25 A/pin contact x 8 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
1000
150V AC for 1min.
30
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces

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