A35P(0.35mm pitch)

Models table for series A35P(0.35mm pitch)
Part No.	Socket/Header	Number of Pins	Mated Height (mm)	Family Name (Head of Product No.)	Type	Applications	Terminal Pitch (mm)	Soldering Terminals	Positioning Bosses	Body Length (mm)	Body Height (mm)	Short Width	Recommended PC Board Pattern Width (mm)	Molded Portion Material	Contact and Post Material	Surface Treatment Material	Rated Current	Insulation Resistance (Min. MΩ)(Initial)	Dielectric Strength	Contact Resistance (M&Omega: Max.)	Insertion and Removal Life (Times)	Packing Quantity	Packing Quantity; Inner Carton (Pcs.)	Packing Quantity; Outer Carton (Pcs.)
AXF5A0012	Socket	100	0.8mm	AXF5	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	19.85	0.77	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A1012	Header	10	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	3.40	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A5412	Header	54	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	11.10	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A6012	Header	60	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	12.15	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A3012	Header	30	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	6.90	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF5A1212	Socket	12	0.8mm	AXF5	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	4.45	0.77	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF5A5412	Socket	54	0.8mm	AXF5	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	11.80	0.77	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF5A1612	Socket	16	0.8mm	AXF5	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	5.15	0.77	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A3412	Header	34	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	7.60	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A4012	Header	40	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	8.65	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces

Models table for series A35P(0.35mm pitch)
Part No.	Socket/Header	Number of Pins	Mated Height (mm)	Family Name (Head of Product No.)	Type	Applications	Terminal Pitch (mm)	Soldering Terminals	Positioning Bosses	Body Length (mm)	Body Height (mm)	Short Width	Recommended PC Board Pattern Width (mm)	Molded Portion Material	Contact and Post Material	Surface Treatment Material	Rated Current	Insulation Resistance (Min. MΩ)(Initial)	Dielectric Strength	Contact Resistance (M&Omega: Max.)	Insertion and Removal Life (Times)	Packing Quantity	Packing Quantity; Inner Carton (Pcs.)	Packing Quantity; Outer Carton (Pcs.)
AXF5A0012	Socket	100	0.8mm	AXF5	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	19.85	0.77	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A1012	Header	10	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	3.40	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A5412	Header	54	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	11.10	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A6012	Header	60	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	12.15	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A3012	Header	30	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	6.90	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF5A1212	Socket	12	0.8mm	AXF5	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	4.45	0.77	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF5A5412	Socket	54	0.8mm	AXF5	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	11.80	0.77	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF5A1612	Socket	16	0.8mm	AXF5	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	5.15	0.77	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A3412	Header	34	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	7.60	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces
AXF6A4012	Header	40	0.8mm	AXF6	BOARD-TO-FPC	DSC, Mobile devices	0.35	with	without	8.65	0.65	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	1.5 A/pin contact x 4 pin contacts or 1.25 A/pin contact x 8 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts)	1000	150V AC for 1min.	30	30	EMBOSSED TAPE AND PLASTIC REEL	5,000 pieces (1-reel)	10,000 pieces