Item | Performance characteristics |
---|---|
Socket/<br>Header | Socket |
Number of Pins | 6 |
Mated Height (mm) | 0.6mm |
Family Name (Head of Product No.) | AXF3 |
Type | BOARD-TO-FPC |
Applications | Smartphones, Tablet PCs, Mobile devices |
Soldering Terminals | with |
Positioning Bosses | without |
Body Length (mm) | 4.45 |
Body Height (mm) | 0.59 |
Short Width | 2.40 |
Recommended PC Board Pattern Width (mm) | 2.80 |
Molded Portion Material | LCP resin (UL94V-0) |
Contact and Post Material | Copper alloy |
Surface Treatment Material | Base: Ni plating Surface: Au plating |
Rated Current | 3.0A/pin contact (Power terminal) 0.3A/pin contact (Signal terminal) |
Insulation Resistance (Min. MΩ)(Initial) | 1000 |
Dielectric Strength | 150V AC for 1min. |
Contact Resistance (M&Omega: Max.) | Power terminal: Max. 20mΩ Signal terminal: Max. 90mΩ |
Insertion and Removal Life (Times) | Mechanical life: 30 times Contact resistance: Power terminal: Max. 20mΩ Signal terminal: Max. 90mΩ Composite removal force: Min. 7N |
Soldering Heat Resistance | The initial specification must be satisfied electrically and mechanically |
Packing Quantity | EMBOSSED TAPE AND PLASTIC REEL |
Packing Quantity; Inner Carton (Pcs.) | 15,000 pieces (1-reel) |
Packing Quantity; Outer Carton (Pcs.) | 30,000 pieces |
Piece Type | 2 Pieces type (Socket) |
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For pricing, delivery and technical questions related to this service, please direct to them.
Panasonic assumes no responsibility for any dealings you may have with distributors.
B01 & B02 Series Board-to-FPC Connectors