A35S Series (0.35mm Pitch)

The A35S (0.35mm Pitch) Series Connectors are Narrow Pitch for Board-To-FPC. The A35S Series Connectors contribute to device miniaturization and advanced functionality with 2.5mm Width, 0.35mm Pitch and 0.8mm Mated Height.

With various pin options from 10 to 100 pins, these Low Profile Connectors also feature the Panasonic Tough Contact construction which consists of bellow contacts for enhanced spring characteristics that provide greater resistance to shock and vibration forces.

Panasonic's A35S (0.35mm Pitch) Series Connectors also feature a double contact "V-notch" construction, thus increasing the contact pressure and eliminating flux and other foreign matters more effectively than conventional products and preventing them from obstructing the contact.

All Panasonic Connectors employ an exposed Nickel-plated barrier to prevent solder from creeping up the terminal despite the ultra-low profile of the contact. Additionally, each contact also includes a porosity treatment membrane to resist corrosive gas environments and allow for lower insertion force during mating.

A35S (0.35mm Pitch) Series Connectors also feature a simple lock structure which creates an audible and tactile click sensation during mating to ensure that they have been mated properly.

 

Part Number List

Results 32
Models table for series A35S Series (0.35mm Pitch)
Part No.DatasheetSocket/<br>HeaderNumber of PinsMated Height (mm)Family Name (Head of Product No.)TypeApplicationsTerminal Pitch (mm)Soldering TerminalsPositioning BossesBody Length (mm)Body Height (mm)Short Width Recommended PC Board Pattern Width (mm)Contact and Post MaterialMolded Portion Material Surface Treatment Material Rated CurrentInsulation Resistance (Min. M&Omega;)(Initial)Dielectric StrengthContact Resistance (M&Omega: Max.)Insertion and Removal Life (Times)Packing QuantityPacking Quantity; Inner Carton (Pcs.) Packing Quantity; Outer Carton (Pcs.)Piece Type
Socket
20
0.8mm
AXE7
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
5.85
0.77
2.50
2.90
Copper alloy
LCP resin (UL94V-0)
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
2 Pieces type (Socket)
Socket
24
0.8mm
AXE7
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
6.55
0.77
2.50
2.90
Copper alloy
LCP resin (UL94V-0)
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
2 Pieces type (Socket)
Socket
10
0.8mm
AXE7
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
4.10
0.77
2.50
2.90
Copper alloy
LCP resin (UL94V-0)
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
2 Pieces type (Socket)
Socket
50
0.8mm
AXE7
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
11.10
0.77
2.50
2.90
Copper alloy
LCP resin (UL94V-0)
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
2 Pieces type (Socket)
Socket
12
0.8mm
AXE7
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
4.45
0.77
2.50
2.90
Copper alloy
LCP resin (UL94V-0)
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
2 Pieces type (Socket)
Socket
44
0.8mm
AXE7
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
10.05
0.77
2.50
2.90
Copper alloy
LCP resin (UL94V-0)
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
2 Pieces type (Socket)
Header
50
0.8mm
AXE8
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
10.40
0.65
2.00
2.40
Copper alloy
LCP resin (UL94V-0)
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
2 Pieces type (Header)
Header
54
0.8mm
AXE8
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
11.10
0.65
2.00
2.40
Copper alloy
LCP resin (UL94V-0)
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
2 Pieces type (Header)
Header
12
0.8mm
AXE8
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
3.75
0.65
2.00
2.40
Copper alloy
LCP resin (UL94V-0)
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
2 Pieces type (Header)
Header
16
0.8mm
AXE8
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
0.35
with
without
4.45
0.65
2.00
2.40
Copper alloy
LCP resin (UL94V-0)
Base: Ni plating Surface: Au plating
0.25A/pin contact (Max. 4A at total pin contacts)
1000
150V AC for 1min.
100
30
EMBOSSED TAPE AND PLASTIC REEL
5,000 pieces (1-reel)
10,000 pieces
2 Pieces type (Header)

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