Socket
60
0.8mm
Embossed packaging (4 mm pitch)
15,000 pieces (1-reel)
30,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
0.77
14.50
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
2 Pieces type (Socket)
Socket
44
0.8mm
Embossed packaging (4 mm pitch)
15,000 pieces (1-reel)
30,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
0.77
11.30
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
2 Pieces type (Socket)
Socket
36
0.8mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
0.77
9.70
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Socket
40
0.8mm/1.0mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
0.77
10.50
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
2 Pieces type (Socket)
Socket
40
0.8mm
Embossed packaging (4 mm pitch)
15,000pieces (1reel)
30,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
0.77
10.50
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
2 Pieces type (Socket)
Socket
32
0.8mm/1.0mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
0.77
8.90
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Socket
34
0.8mm
Embossed packaging (4 mm pitch)
15,000pieces (1reel)
30,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
0.77
9.30
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
2 Pieces type (Socket)
Socket
24
0.8mm
Embossed packaging (4 mm pitch)
15,000pieces (1reel)
30,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
0.77
7.30
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
2 Pieces type (Socket)
Socket
28
0.8mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
0.77
8.10
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Socket
26
0.8mm/1.0mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
0.77
7.70
2.50
2.90
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL