Header
36
0.8mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE6
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
2.40
9.00
2.00
0.65
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Socket
18
0.8mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
2.90
6.10
2.50
0.77
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Socket
22
0.8mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
2.90
6.90
2.50
0.77
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Socket
28
0.8mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
2.90
8.10
2.50
0.77
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Socket
26
0.8mm/1.0mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
2.90
7.70
2.50
0.77
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Socket
32
0.8mm/1.0mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
2.90
8.90
2.50
0.77
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Socket
36
0.8mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE5
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
2.90
9.70
2.50
0.77
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Header
22
0.8mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE6
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
2.40
6.20
2.00
0.65
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Header
32
0.8mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE6
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
2.40
8.20
2.00
0.65
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL
Header
32
1.0mm
Embossed packaging (8 mm pitch)
5,000 pieces (1-reel)
10,000 pieces
AXE6
BOARD-TO-FPC
Smartphones, Laptops, Mobile devices
0.4
with
without
2.40
8.20
2.00
0.85
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
0.3A/pin contact (Max. 5A at total pin contacts)
1000
150V AC for 1min.
30
90
EMBOSSED TAPE AND PLASTIC REEL