A4S Series (0.4mm pitch)

Panasonic’s A4S Series Connectors were designed with Tough Contact construction to provide high contact reliability and high resistance to various environmental conditions. The A4S Series Connector features a simple lock structure that provides tactile feedback to ensure excellent mating/unmating operation feel. This Connector Series is ideal for use in various applications, including smartphones, laptops and other mobile devices.

A4S Series (0.4mm pitch)

Part number list

Results 85

Models table for series A4S Series (0.4mm pitch)
Part No.	Socket/ Header	Number of Pins	Mated Height (mm)	Package	Packing Quantity; Inner Carton (Pcs.)	Packing Quantity; Outer Carton (Pcs.)	Family Name (Head of Product No.)	Type	Applications	Terminal Pitch (mm)	Soldering Terminals	Positioning Bosses	Body Height (mm)	Body Length (mm)	Short Width	Recommended PC Board Pattern Width (mm)	Molded Portion Material	Contact and Post Material	Surface Treatment Material	Rated Current	Insulation Resistance (Min. MΩ)(Initial)	Dielectric Strength	Insertion and Removal Life (Times)	Contact Resistance (M&Omega: Max.)	Packing Quantity	Piece Type
AXE516127	Socket	16	0.8mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE5	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.77	5.70	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Socket)
AXE518127	Socket	18	0.8mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE5	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.77	6.10	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL
AXE514127	Socket	14	0.8mm/1.0mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE5	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.77	5.30	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Socket)
AXE670124	Header	70	0.8mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.65	15.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE664124D	Header	64	0.8mm	Embossed packaging (4 mm pitch)	15,000 pieces (1-reel)	30,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.65	14.60	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE640224	Header	40	1.0mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.85	9.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE670224	Header	70	1.0mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.85	15.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE680224	Header	80	1.0mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.85	17.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE660124D	Header	60	0.8mm	Embossed packaging (4 mm pitch)	15,000 pieces (1-reel)	30,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.65	13.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE650124	Header	50	0.8mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.65	11.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)

Models table for series A4S Series (0.4mm pitch)
Part No.	Socket/ Header	Number of Pins	Mated Height (mm)	Package	Packing Quantity; Inner Carton (Pcs.)	Packing Quantity; Outer Carton (Pcs.)	Family Name (Head of Product No.)	Type	Applications	Terminal Pitch (mm)	Soldering Terminals	Positioning Bosses	Body Height (mm)	Body Length (mm)	Short Width	Recommended PC Board Pattern Width (mm)	Molded Portion Material	Contact and Post Material	Surface Treatment Material	Rated Current	Insulation Resistance (Min. MΩ)(Initial)	Dielectric Strength	Insertion and Removal Life (Times)	Contact Resistance (M&Omega: Max.)	Packing Quantity	Piece Type
AXE516127	Socket	16	0.8mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE5	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.77	5.70	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Socket)
AXE518127	Socket	18	0.8mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE5	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.77	6.10	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL
AXE514127	Socket	14	0.8mm/1.0mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE5	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.77	5.30	2.50	2.90	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Socket)
AXE670124	Header	70	0.8mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.65	15.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE664124D	Header	64	0.8mm	Embossed packaging (4 mm pitch)	15,000 pieces (1-reel)	30,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.65	14.60	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE640224	Header	40	1.0mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.85	9.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE670224	Header	70	1.0mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.85	15.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE680224	Header	80	1.0mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.85	17.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE660124D	Header	60	0.8mm	Embossed packaging (4 mm pitch)	15,000 pieces (1-reel)	30,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.65	13.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)
AXE650124	Header	50	0.8mm	Embossed packaging (8 mm pitch)	5,000 pieces (1-reel)	10,000 pieces	AXE6	BOARD-TO-FPC	Smartphones, Laptops, Mobile devices	0.4	with	without	0.65	11.80	2.00	2.40	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	0.3A/pin contact (Max. 5A at total pin contacts)	1000	150V AC for 1min.	30	90	EMBOSSED TAPE AND PLASTIC REEL	2 Pieces type (Header)