Item | Performance characteristics |
---|---|
Socket/<br>Header | Header |
Number of Pins | 50 |
Mated Height (mm) | 0.8mm |
Family Name (Head of Product No.) | AXE8 |
Type | BOARD-TO-FPC |
Applications | Smartphones, Tablet PCs, Mobile devices |
Terminal Pitch (mm) | 0.35 |
Soldering Terminals | with |
Positioning Bosses | without |
Body Length (mm) | 10.40 |
Body Height (mm) | 0.65 |
Short Width | 2.00 |
Recommended PC Board Pattern Width (mm) | 2.40 |
Contact and Post Material | Copper alloy |
Molded Portion Material | LCP resin (UL94V-0) |
Surface Treatment Material | Base: Ni plating Surface: Au plating |
Rated Current | 0.25A/pin contact (Max. 4A at total pin contacts) |
Insulation Resistance (Min. MΩ)(Initial) | 1000 |
Dielectric Strength | 150V AC for 1min. |
Contact Resistance (M&Omega: Max.) | 100 |
Insertion and Removal Life (Times) | 30 |
Packing Quantity | EMBOSSED TAPE AND PLASTIC REEL |
Packing Quantity; Inner Carton (Pcs.) | 5,000 pieces (1-reel) |
Packing Quantity; Outer Carton (Pcs.) | 10,000 pieces |
Piece Type | 2 Pieces type (Header) |
B01 & B02 Series Board-to-FPC Connectors