B02 Series

B02 Series Board-To-FPC High Current Stacking Connectors

High Current Capacity Required For Battery Connectors Of Small Devices

The B02 Series Board-To-FPC High Current Stacking Connectors, allow devices to be designed thinner due to their low profile mated height of 0.7mm and their miniature design provides board space savings.

The B02 Series also features a high current capacity of 10A (5.0A/pin x 2 pins) which is a capability required for battery connections of small devices. The B02 Series Connectors are not easily breakable during the insertion or removal process due to the Panasonic Tough Contact structure which provides these Connectors with high resistance to shock and vibration. The insertion guides and superior click feel of the B02 Series Connectors provide ease of assembly and true confirmation that they have been inserted properly.

B02 Series

Part number list

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Models table for series B02 Series
Part No.	Datasheet	Socket/ Header	Number of Pins	Mated Height (mm)	Family Name (Head of Product No.)	Type	Applications	Soldering Terminals	Positioning Bosses	Body Length (mm)	Body Height (mm)	Short Width	Recommended PC Board Pattern Width (mm)	Molded Portion Material	Contact and Post Material	Surface Treatment Material	Rated Current	Insulation Resistance (Min. MΩ)(Initial)	Dielectric Strength	Contact Resistance (M&Omega: Max.)	Insertion and Removal Life (Times)	Soldering Heat Resistance	Packing Quantity	Packing Quantity; Inner Carton (Pcs.)	Packing Quantity; Outer Carton (Pcs.)	Piece Type
AXF482700		Header	8	0.7mm	AXF4	BOARD-TO-FPC	Smartphones, Tablet PCs, Mobile devices	with	without	4.16	0.55	1.80	2.20	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	5.0A/pin contact (Power terminal) 0.3A/pin contact (Signal terminal)	1000	150V AC for 1min.	Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ	Mechanical life: 30 times Contact resistance: Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ Composite removal force: Min. 7N	The initial specification must be satisfied electrically and mechanically	EMBOSSED TAPE AND PLASTIC REEL	15,000 pieces (1-reel)	30,000 pieces	2 Pieces type (Header)
AXF382700		Socket	8	0.7mm	AXF3	BOARD-TO-FPC	Smartphones, Tablet PCs, Mobile devices	with	without	4.85	0.69	2.20	2.60	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	5.0A/pin contact (Power terminal) 0.3A/pin contact (Signal terminal)	1000	150V AC for 1min.	Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ	Mechanical life: 30 times Contact resistance: Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ Composite removal force: Min. 7N	The initial specification must be satisfied electrically and mechanically	EMBOSSED TAPE AND PLASTIC REEL	15,000 pieces (1-reel)	30,000 pieces	2 Pieces type (Socket)

Models table for series B02 Series
Part No.	Datasheet	Socket/ Header	Number of Pins	Mated Height (mm)	Family Name (Head of Product No.)	Type	Applications	Soldering Terminals	Positioning Bosses	Body Length (mm)	Body Height (mm)	Short Width	Recommended PC Board Pattern Width (mm)	Molded Portion Material	Contact and Post Material	Surface Treatment Material	Rated Current	Insulation Resistance (Min. MΩ)(Initial)	Dielectric Strength	Contact Resistance (M&Omega: Max.)	Insertion and Removal Life (Times)	Soldering Heat Resistance	Packing Quantity	Packing Quantity; Inner Carton (Pcs.)	Packing Quantity; Outer Carton (Pcs.)	Piece Type
AXF482700		Header	8	0.7mm	AXF4	BOARD-TO-FPC	Smartphones, Tablet PCs, Mobile devices	with	without	4.16	0.55	1.80	2.20	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	5.0A/pin contact (Power terminal) 0.3A/pin contact (Signal terminal)	1000	150V AC for 1min.	Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ	Mechanical life: 30 times Contact resistance: Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ Composite removal force: Min. 7N	The initial specification must be satisfied electrically and mechanically	EMBOSSED TAPE AND PLASTIC REEL	15,000 pieces (1-reel)	30,000 pieces	2 Pieces type (Header)
AXF382700		Socket	8	0.7mm	AXF3	BOARD-TO-FPC	Smartphones, Tablet PCs, Mobile devices	with	without	4.85	0.69	2.20	2.60	LCP resin (UL94V-0)	Copper alloy	Base: Ni plating Surface: Au plating	5.0A/pin contact (Power terminal) 0.3A/pin contact (Signal terminal)	1000	150V AC for 1min.	Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ	Mechanical life: 30 times Contact resistance: Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ Composite removal force: Min. 7N	The initial specification must be satisfied electrically and mechanically	EMBOSSED TAPE AND PLASTIC REEL	15,000 pieces (1-reel)	30,000 pieces	2 Pieces type (Socket)

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Apr 10, 2024

B02 Series

B02 Series Board-To-FPC High Current Stacking Connectors

B02 Series

Part number list

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