Specifications

Specifications table for model AXF6G3212
ItemPerformance characteristics
Socket/<br>HeaderHeader
Number of Pins32
Mated Height (mm)1.5mm
Family Name (Head of Product No.)AXF6
TypeBOARD-TO-FPC
ApplicationsDSC, Mobile devices, Industrial equipment
Terminal Pitch (mm)0.4
Soldering Terminalswith
Positioning Bosseswithout
Body Length (mm)8.30
Body Height (mm)1.24
Short Width 2.35
Recommended PC Board Pattern Width (mm)2.95
Molded Portion Material LCP resin (UL94V-0)
Contact and Post MaterialCopper alloy
Surface Treatment Material Base: Ni plating Surface: Au plating
Rated Current1.0 A/pin contact x 10 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
Insulation Resistance (Min. M&Omega;)(Initial)1000
Dielectric Strength150V AC for 1min.
Contact Resistance (M&Omega: Max.)40
Insertion and Removal Life (Times)50
Packing QuantityEMBOSSED TAPE AND PLASTIC REEL
Packing Quantity; Inner Carton (Pcs.) 3,000 pieces (1-reel)
Packing Quantity; Outer Carton (Pcs.)6,000 pieces

Stock check

Model image for AXF6G3212

AXF6G3212

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