R-5775(K)/R-5670(K)
Specifications
| Item | Performance characteristics |
|---|---|
| Tg (DSC), | 185 °C |
| Tg (DMA), | 210 °C |
| Td (Thermal Decomposition) (°C) | 410 °C |
| T288 (Without Cu) (min) | >120 min |
| T288 (With Cu) (min) | >120 min |
| CTE-Y <Tg (ppm/℃) | 14-16 ppm/°C |
| CTE-Y, <Tg | 14-16 ppm/°C |
| CTE-Z <Tg (ppm/℃) | 45 ppm/°C |
| CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | 260 ppm/°C |
| Thermal Conductivity, (W/m・K) | 0.42 W/m · K |
| Volume Resistivity (MΩ・cm) | 1 x 10⁹ MΩ · cm |
| Surface Resistivity (mΩ) | 1 x 10⁸ MΩ |
| Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50 | 3.4 |
| Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50 | |
| Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | 3.4 |
| Df at 1 GHz | 0.002 |
| Df at 10 GHz | |
| Df at 12 GHz | 0.004 |
| Water Absorption (%) | 0.14% |
| Poisson's Ratio | 0.2 |
| Flexural Warp (MD) (GPa) | 19 GPa |
| Flexural Fill (TD) (GPa) | 18 GPa |
| Peel Strength (1 Oz. Cu) (kN/m) | 0.8 (Cu:H-VLP) kN/m |
| Flammability | 94V-0 |
| Sample Thickness (mm) | 0.75 mm |
Stock check
R-5775(K)/R-5670(K)
What's New
