MEGTRON 6

Ultra-low Loss, Highly Heat Resistant Circuit Board Materials

Low Dielectric Constant (Dk) Glass Cloth - LaminateR-5775(N)/PrepregR-5670(N)

Standard E Glass Cloth - LaminateR-5775/PrepregR-5670

The MEGTRON 6 Family, including MEGTRON 6(G), MEGTRON 6(K), MEGTRON 6(N), are the original PCB industry standards. The products are ideal for mobile, networking, and wireless applications requiring high-speed, ultra-low loss circuit materials.

MEGTRON 6 provides excellent high-density interconnect (HDI) and thermal performance.

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MEGTRON 6

Part number list

Results 3

Models table for series MEGTRON 6
Part No.	Tg (DSC),	Tg (DMA),	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-Y	CTE-Y,	CTE-Z	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 12 GHz	Water Absorption (%)	Poisson's Ratio	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-5775(N)/R-5670(N)	185 °C	210 °C	410 °C	>120 min	>120 min	14-16 ppm/°C	14-16 ppm/°C	45 ppm/°C	260 ppm/°C	0.42 W/m · cm	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.4	3.4	0.002	0.004	0.14%	0.2	19 GPa	18 GPa	0.8 (Cu:H-VLP) kN/m	94V-0	0.75 mm
R-5775(K)/R-5670(K)	185 °C	210 °C	410 °C	>120 min	>120 min	14-16 ppm/°C	14-16 ppm/°C	45 ppm/°C	260 ppm/°C	0.42 W/m · K	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.4	3.4	0.002	0.004	0.14%	0.2	19 GPa	18 GPa	0.8 (Cu:H-VLP) kN/m	94V-0	0.75 mm
R-5775(G)/R-5775(G)	185 °C	210°C	410 °C	>120 min	>120 min	14-16 ppm/°C	14-16 ppm/°C	45 ppm/°C	260 ppm/°C	0.42 W/m · cm	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.4	3.4	0.002	0.004	0.14%	0.2	19 GPa	18 GPa	0.8 (Cu:H-VLP) kN/m	94V-0

Models table for series MEGTRON 6
Part No.	Tg (DSC),	Tg (DMA),	Td (Thermal Decomposition) (°C)	T288 (Without Cu) (min)	T288 (With Cu) (min)	CTE-Y	CTE-Y,	CTE-Z	CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃)	Thermal Conductivity, (W/m・K)	Volume Resistivity (MΩ・cm)	Surface Resistivity (mΩ)	Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50	Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50	Df at 1 GHz	Df at 12 GHz	Water Absorption (%)	Poisson's Ratio	Flexural Warp (MD) (GPa)	Flexural Fill (TD) (GPa)	Peel Strength (1 Oz. Cu) (kN/m)	Flammability	Sample Thickness (mm)
R-5775(N)/R-5670(N)	185 °C	210 °C	410 °C	>120 min	>120 min	14-16 ppm/°C	14-16 ppm/°C	45 ppm/°C	260 ppm/°C	0.42 W/m · cm	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.4	3.4	0.002	0.004	0.14%	0.2	19 GPa	18 GPa	0.8 (Cu:H-VLP) kN/m	94V-0	0.75 mm
R-5775(K)/R-5670(K)	185 °C	210 °C	410 °C	>120 min	>120 min	14-16 ppm/°C	14-16 ppm/°C	45 ppm/°C	260 ppm/°C	0.42 W/m · K	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.4	3.4	0.002	0.004	0.14%	0.2	19 GPa	18 GPa	0.8 (Cu:H-VLP) kN/m	94V-0	0.75 mm
R-5775(G)/R-5775(G)	185 °C	210°C	410 °C	>120 min	>120 min	14-16 ppm/°C	14-16 ppm/°C	45 ppm/°C	260 ppm/°C	0.42 W/m · cm	1 x 10⁹ MΩ · cm	1 x 10⁸ MΩ	3.4	3.4	0.002	0.004	0.14%	0.2	19 GPa	18 GPa	0.8 (Cu:H-VLP) kN/m	94V-0

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