Panasonic Offers Granule Epoxy Mold Compounds (EMC) For Fan Out Wafer Level Packaging (FO-WLP) And Panel Level Packaging (PLP) For Compression Molding.
These products provide excellent warpage control and are distinguished by their high purity and low occurance of hollow filler defects. They also have excellent filling performance which make them ideal candidates for the large area encapsulation requirements inherent in FO-WLP and PLP designs.
WLP/PLP EMC
Part number list
Results 2
| Part No. | Datasheet | Tg (TMA) (⁰C ) | CTE-1 (TMA) (ppm/℃) | Flexural Modulus (@25⁰C) (GPa) | Filler Size (Max) (μm) | Mold Shrinkage (%) | Filler Type (FusedSilica/CrystalineSilica/Alumina) | Filler Shape (Spherical/Flake) | Filler Content (in Ash) (% wt) | Filler size (Avg) (μm) | Sprial Flow (cm) | Gelation Time (Sec) | Viscosity (@175⁰C) (Pa Sec) | Specific gravity | CTE-2 (TMA) (ppm/℃) | Flexural Strength(@25⁰C) (MPa) | Flexural Strength(@260⁰C) (MPa) | Flexural Modulus(@260⁰C) (GPa) | Dielectric Constant (1MHz) | Dissipation Factor (1MHz) | Flame Retardant (Yes/No) | Flammability (UL-94) | Thermal Conductivity (W/mK) | Low Alpha Type (Yes/No) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
218 | 9 | 10 | 20 | 0.11 | Fused | Spherical | 82 | 5 | 181 | 59 | 15 | 1.90 | 50 | 50 | 7 | 0.5 | 4.1 | 0.017 | No | HB | 0.8 | No | ||
210 | 8 | 8 | 20 | 0.15 | Fused | Spherical | 80 | 5 | 200 | 56 | 13 | 1.90 | 56 | 63 | 8 | 0.4 | 4.5 | 0.033 | No | HB | 0.8 | No |
