Molded Underfill (MUF) For fcBGA DRAM Packages

Panasonic Epoxy Mold Compounds (EMC) for flip-chip ball grid array (fcBGA) memory packaging (DDR3, DDR4, GDDR5, GDDR6, etc.) are characterized by their excellent filling performance. These low alpha compounds are formulated for high-volume, continuous transfer molding.

Standard, high-volume product is CV8580 Series. Additional versions available upon request.