SiP MUF

Molded Underfill (MUF) Epoxy Mold Compounds (EMC) For System in Package (SiP) Designs

Panasonic's SiP EMC offer industry-leading warpage control for large and complex packaging formats. Best-in-class filling ability enables reliable underfilling and overmolding of an increasing number of components in each package. These products offer superior adhesion to the EMI layer and are compatible with the shallow marking required by thin package designs.

Standard, high-volume product is CV8713 Series. Additional transfer and compression molding versions available upon request.

Part Number List

Results 1
Models table for series SiP MUF
Part No.DatasheetTg (TMA) (⁰C )CTE-1 (TMA) (ppm/℃)Flexural Modulus (@25⁰C) (GPa)Filler Size (Max) (μm)Mold Shrinkage (%)Filler Type (FusedSilica/CrystalineSilica/Alumina)Filler Shape (Spherical/Flake)Filler Content (in Ash) (% wt)Filler size (Avg) (μm)Sprial Flow (cm)Gelation Time (Sec)Viscosity (@175⁰C) (Pa Sec)Specific gravityCTE-2 (TMA) (ppm/℃)Flexural Strength(@25⁰C) (MPa)Flexural Strength(@260⁰C) (MPa)Flexural Modulus(@260⁰C) (GPa)Dielectric Constant (1MHz)Dissipation Factor (1MHz)Flame Retardant (Yes/No)Flammability (UL-94)Thermal Conductivity (W/mK)Low Alpha Type (Yes/No)
145
9
24
20
0.20
Fused Silica
Spherical
87.5
5-6
155
45
12
1.98
38
170
23
0.5
3.9
0.005
No
V-0
0.95
No

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