Molded Underfill (MUF) Epoxy Mold Compounds (EMC) For System in Package (SiP) Designs

Panasonic's SiP EMC offer industry-leading warpage control for large and complex packaging formats. Best-in-class filling ability enables reliable underfilling and overmolding of an increasing number of components in each package. These products offer superior adhesion to the EMI layer and are compatible with the shallow marking required by thin package designs.

Standard, high-volume product is CV8713 Series. Additional transfer and compression molding versions available upon request.