FBGA EMC
Fine-Pitch Ball Grid Array (FBGA) Epoxy Mold Compound (EMC)
Panasonic granule EMC for compression molding of FBGA packages offer excellent warpage control, good filling performance and low alpha performance. Commonly used for LPDDR in PoPt packages.
Standard, high-volume products include CV8712 Series. Additional versions available upon request.
Part Number List
Results 3
| Part No. | Datasheet | Tg (TMA) (⁰C ) | CTE-1 (TMA) (ppm/℃) | Flexural Modulus (@25⁰C) (GPa) | Filler Size (Max) (μm) | Mold Shrinkage (%) | Filler Type (FusedSilica/CrystalineSilica/Alumina) | Filler Shape (Spherical/Flake) | Filler Content (in Ash) (% wt) | Filler size (Avg) (μm) | Sprial Flow (cm) | Gelation Time (Sec) | Viscosity (@175⁰C) (Pa Sec) | Specific gravity | CTE-2 (TMA) (ppm/℃) | Flexural Strength(@25⁰C) (MPa) | Flexural Strength(@260⁰C) (MPa) | Flexural Modulus(@260⁰C) (GPa) | Dielectric Constant (1MHz) | Dissipation Factor (1MHz) | Flame Retardant (Yes/No) | Flammability (UL-94) | Thermal Conductivity (W/mK) | Low Alpha Type (Yes/No) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
155 | 8 | 27 | 55 | 0.21 | Fused Silica | Spherial | 88 | 8-12 | 220 | 70 | 25 | 1.99 | 30 | 180 | 28 | 1.2 | 4.2 | 0.010 | No | V-0 | 1.00 | Yes | ||
155 | 7.5 | 27 | 55 | 0.22 | Fused Silica | Spherial | 89 | 8-12 | 200 | 70 | 25 | 2.00 | 27 | 177 | 28 | 1.0 | 4.2 | 0.010 | No | V-0 | 1.00 | Yes | ||
125 | 9 | 33 | 55 | 0.30 | Fused Silica | Spherial | 87 | 8-12 | 200 | 60 | 15 | 1.98 | 33 | 170 | 25 | 0.5 | 4.2 | 0.010 | No | V-0 | 0.98 | Yes |