Panasonic Offers Granule Epoxy Mold Compounds (EMC) For Fan Out Wafer Level Packaging (FO-WLP) And Panel Level Packaging (PLP) For Compression Molding.

These products provide excellent warpage control and are distinguished by their high purity and low occurance of hollow filler defects. They also have excellent filling performance which make them ideal candidates for the large area encapsulation requirements inherent in FO-WLP and PLP designs.