Item | Performance characteristics |
---|---|
Tg (TMA) (⁰C ) | 145 |
CTE-1 (TMA) (ppm/℃) | 9 |
Flexural Modulus (@25⁰C) (GPa) | 24 |
Filler Size (Max) (μm) | 20 |
Mold Shrinkage (%) | 0.20 |
Filler Type (FusedSilica/CrystalineSilica/Alumina) | Fused Silica |
Filler Shape (Spherical/Flake) | Spherical |
Filler Content (in Ash) (% wt) | 87.5 |
Filler size (Avg) (μm) | 5-6 |
Sprial Flow (cm) | 155 |
Gelation Time (Sec) | 45 |
Viscosity (@175⁰C) (Pa Sec) | 12 |
Specific gravity | 1.98 |
CTE-2 (TMA) (ppm/℃) | 38 |
Flexural Strength(@25⁰C) (MPa) | 170 |
Flexural Strength(@260⁰C) (MPa) | 23 |
Flexural Modulus(@260⁰C) (GPa) | 0.5 |
Dielectric Constant (1MHz) | 3.9 |
Dissipation Factor (1MHz) | 0.005 |
Flame Retardant (Yes/No) | No |
Flammability (UL-94) | V-0 |
Thermal Conductivity (W/mK) | 0.95 |
Low Alpha Type (Yes/No) | No |
MEGTRON and XPEDION Series: Connecting to the Future with PCB Materials