The PAN B611-1C Evaluation Board (ENW89861AXKF) features a PAN B611-1x Bluetooth® Low Energy (LE) module, which is based on the Nordic Semiconductor nRF5415L single-chip controller. The PAN B611-1C module (ENW89861C01F) comes without additional flash memory and a 32 kHz crystal, and features an on-board chip antenna ("Economy"). However, the evaluation board features an 8 MB flash memory and a 32 kHz crystal that are externally mounted. You can access all the different module interfaces, such as USB, UART, NFC, and GPIOs, easily, which makes the evaluation board ideally suited for the evaluation of the module and rapid prototyping of products.

The PAN B611-1B Evaluation Board (ENW89861DXKF) features a PAN B611-1B Bluetooth® Low Energy (LE) module, which is based on the Nordic Semiconductor nRF5415L single-chip controller. The PAN B611-1B module (ENW89861F01F) comes without additional flash memory and a 32 kHz crystal, and features a bottom pad ("Economy"). However, the evaluation board features an 8 MB flash memory and a 32 kHz crystal that are externally mounted. You can access all the different module interfaces, such as USB, UART, NFC, and GPIOs, easily, which makes the evaluation board ideally suited for the evaluation of the module and rapid prototyping of products.
 

Reference Documents

• User Guide
• Software Development - Getting Started
• Samples and Demos

Part Numbers

Block Diagram

Features of the PAN B611-1x Series RF Modules

• Surface Mount Type with Castellated Holes, Dimensions:10.35 mm × 9.8 mm × 1.9 mm
• Nordic nRF54L15 featuring a 128 MHz Arm Cortex M33 processor, 1.5 MB non-volatile Memory, and 256 KB RAM
• Bluetooth 6.0 LE including LE 2M and LE Coded PHY
• Supports 802.15.4 - ZigBee® and Thread
• 128-bit AES/ECB/CCM/AAR co-processor
• Up to 32× General Purpose I/Os (GPIO) at 1.7 V to 3.6 V, which are shared by SPI, I²C, UART, PWM, ADC (up to 14-bit), NFC, QSPI