B02 Series

B02 Series Board-To-FPC High Current Stacking Connectors

High Current Capacity Required For Battery Connectors Of Small Devices

The B02 Series Board-To-FPC High Current Stacking Connectors, allow devices to be designed thinner due to their low profile mated height of 0.7mm and their miniature design provides board space savings. 

The B02 Series also features a high current capacity of 10A (5.0A/pin x 2 pins) which is a capability required for battery connections of small devices. The B02 Series Connectors are not easily breakable during the insertion or removal process due to the Panasonic Tough Contact structure which provides these Connectors with high resistance to shock and vibration.  The insertion guides and superior click feel of the B02 Series Connectors provide ease of assembly and true confirmation that they have been inserted properly.

Part Number List

Results 2
Models table for series B02 Series
Part No.DatasheetSocket/HeaderNumber of PinsMated Height (mm)Family Name (Head of Product No.)TypeApplicationsSoldering TerminalsPositioning BossesBody Length (mm)Body Height (mm)Short Width Recommended PC Board Pattern Width (mm)Molded Portion Material Contact and Post MaterialSurface Treatment Material Rated CurrentInsulation Resistance (Min. MΩ)(Initial)Dielectric StrengthContact Resistance (M&Omega: Max.)Insertion and Removal Life (Times)Soldering Heat ResistancePacking QuantityPacking Quantity; Inner Carton (Pcs.) Packing Quantity; Outer Carton (Pcs.)
Header
8
0.7
AXF4
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
with
without
4.16
0.55
1.80
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
5.0A/pin contact (Power terminal)
0.3A/pin contact (Signal terminal)
1000
150V AC for 1min.
Power terminal: Max. 16mΩ
Signal terminal: Max. 90mΩ
Mechanical life: 30 times
Contact resistance:
Power terminal: Max. 16mΩ
Signal terminal: Max. 90mΩ
Composite removal force: Min. 7N
The initial specification must be satisfied electrically and mechanically
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Socket
8
0.7
AXF3
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
with
without
4.85
0.69
2.20
2.60
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
5.0A/pin contact (Power terminal)
0.3A/pin contact (Signal terminal)
1000
150V AC for 1min.
Power terminal: Max. 16mΩ
Signal terminal: Max. 90mΩ
Mechanical life: 30 times
Contact resistance:
Power terminal: Max. 16mΩ
Signal terminal: Max. 90mΩ
Composite removal force: Min. 7N
The initial specification must be satisfied electrically and mechanically
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces

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