Specifications
| Item | Performance characteristics |
|---|---|
| Socket/<br>Header | Header |
| Number of Pins | 8 |
| Mated Height (mm) | 0.7mm |
| Family Name (Head of Product No.) | AXF4 |
| Type | BOARD-TO-FPC |
| Applications | Smartphones, Tablet PCs, Mobile devices |
| Soldering Terminals | with |
| Positioning Bosses | without |
| Body Length (mm) | 4.16 |
| Body Height (mm) | 0.55 |
| Short Width | 1.80 |
| Recommended PC Board Pattern Width (mm) | 2.20 |
| Molded Portion Material | LCP resin (UL94V-0) |
| Contact and Post Material | Copper alloy |
| Surface Treatment Material | Base: Ni plating Surface: Au plating |
| Rated Current | 5.0A/pin contact (Power terminal) 0.3A/pin contact (Signal terminal) |
| Insulation Resistance (Min. MΩ)(Initial) | 1000 |
| Dielectric Strength | 150V AC for 1min. |
| Contact Resistance (M&Omega: Max.) | Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ |
| Insertion and Removal Life (Times) | Mechanical life: 30 times Contact resistance: Power terminal: Max. 16mΩ Signal terminal: Max. 90mΩ Composite removal force: Min. 7N |
| Soldering Heat Resistance | The initial specification must be satisfied electrically and mechanically |
| Packing Quantity | EMBOSSED TAPE AND PLASTIC REEL |
| Packing Quantity; Inner Carton (Pcs.) | 15,000 pieces (1-reel) |
| Packing Quantity; Outer Carton (Pcs.) | 30,000 pieces |
| Piece Type | 2 Pieces type (Header) |
Stock check
AXF482700
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