AXF5G2012
Specification
| Item | Performance characteristics |
|---|---|
| Socket/<br>Header | Socket |
| Number of Pins | 20 |
| Mated Height (mm) | 1.5mm |
| Family Name (Head of Product No.) | AXF5 |
| Type | BOARD-TO-FPC |
| Applications | DSC, Mobile devices, Industrial equipment |
| Terminal Pitch (mm) | 0.4 |
| Soldering Terminals | with |
| Positioning Bosses | without |
| Body Length (mm) | 6.70 |
| Body Height (mm) | 1.45 |
| Short Width | 3.60 |
| Recommended PC Board Pattern Width (mm) | 4.20 |
| Molded Portion Material | LCP resin (UL94V-0) |
| Contact and Post Material | Copper alloy |
| Surface Treatment Material | Base: Ni plating Surface: Au plating |
| Rated Current | 1.0 A/pin contact x 10 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts) |
| Insulation Resistance (Min. MΩ)(Initial) | 1000 |
| Dielectric Strength | 150V AC for 1min. |
| Contact Resistance (M&Omega: Max.) | 40 |
| Insertion and Removal Life (Times) | 50 |
| Packing Quantity | EMBOSSED TAPE AND PLASTIC REEL |
| Packing Quantity; Inner Carton (Pcs.) | 3,000 pieces (1-reel) |
| Packing Quantity; Outer Carton (Pcs.) | 6,000 pieces |
| Piece Type | 2 Pieces type (Socket) |
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