B01

The B01 Series Board-to-FPC Connectors features a high current rating of 6.0A (3.0A/Pin x 2) and is suitable for high-current battery applications in small mobile devices, such as wearable electronics. With a mated height of 0.6mm, this Connector requires a small footprint of 2.40 x 4.45mm for the socket and 1.8 x 3.76mm for the header. A high removal force of 10N min. helps maintain a high-reliability connection, offering a more robust solution to battery applications.

Features:

  • Small size with 0.6 mm Mated Height
  • High Removal Force of 10N min.
  • Current Rating of 6.0A (3.0A/Pin x 2)
  • RoHS/REACH Compliant

Benefits:

  • Low Space Requirements
  • Useful in Compact Electronic Devices
  • Excellent Mechanical Stability
     

Part Number List

Results 4
Models table for series B01
Part No.DatasheetSocket/HeaderNumber of PinsMated Height (mm)Family Name (Head of Product No.)TypeApplicationsSoldering TerminalsPositioning BossesBody Length (mm)Body Height (mm)Short Width Recommended PC Board Pattern Width (mm)Molded Portion Material Contact and Post MaterialSurface Treatment Material Rated CurrentInsulation Resistance (Min. MΩ)(Initial)Dielectric StrengthContact Resistance (M&Omega: Max.)Insertion and Removal Life (Times)Soldering Heat ResistancePacking QuantityPacking Quantity; Inner Carton (Pcs.) Packing Quantity; Outer Carton (Pcs.)
Header
6
0.6mm
AXF4
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
with
without
3.76
0.47
1.80
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
3.0A/pin contact (Power terminal)
0.3A/pin contact (Signal terminal)
1000
150V AC for 1min.
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Mechanical life: 30 times
Contact resistance:
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Composite removal force: Min. 7N
The initial specification must be satisfied electrically and mechanically
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Socket
6
0.8mm
AXF3
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
with
without
4.45
0.79
2.40
2.80
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
3.0A/pin contact (Power terminal)
0.3A/pin contact (Signal terminal)
1000
150V AC for 1min.
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Mechanical life: 30 times
Contact resistance:
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Composite removal force: Min. 7N
The initial specification must be satisfied electrically and mechanically
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Socket
6
0.6mm
AXF3
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
with
without
4.45
0.59
2.40
2.80
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
3.0A/pin contact (Power terminal)
0.3A/pin contact (Signal terminal)
1000
150V AC for 1min.
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Mechanical life: 30 times
Contact resistance:
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Composite removal force: Min. 7N
The initial specification must be satisfied electrically and mechanically
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces
Header
6
0.8mm
AXF4
BOARD-TO-FPC
Smartphones, Tablet PCs, Mobile devices
with
without
3.76
0.65
1.80
2.20
LCP resin (UL94V-0)
Copper alloy
Base: Ni plating Surface: Au plating
3.0A/pin contact (Power terminal)
0.3A/pin contact (Signal terminal)
1000
150V AC for 1min.
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Mechanical life: 30 times
Contact resistance:
Power terminal: Max. 20mΩ
Signal terminal: Max. 90mΩ
Composite removal force: Min. 7N
The initial specification must be satisfied electrically and mechanically
EMBOSSED TAPE AND PLASTIC REEL
15,000 pieces (1-reel)
30,000 pieces

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