Specifications
Item | Performance characteristics |
---|---|
Socket/<br>Header | Socket |
Number of Pins | 30 |
Mated Height (mm) | 1.5mm |
Family Name (Head of Product No.) | AXF5 |
Type | BOARD-TO-FPC |
Applications | DSC, Mobile devices, Industrial equipment |
Terminal Pitch (mm) | 0.4 |
Soldering Terminals | with |
Positioning Bosses | without |
Body Length (mm) | 8.70 |
Body Height (mm) | 1.45 |
Short Width | 3.60 |
Recommended PC Board Pattern Width (mm) | 4.20 |
Molded Portion Material | LCP resin (UL94V-0) |
Contact and Post Material | Copper alloy |
Surface Treatment Material | Base: Ni plating Surface: Au plating |
Rated Current | 1.0 A/pin contact x 10 pin contacts (as power contact) 0.5 A/pin contact (as signal contact) (Max. 12 A at total pin contacts) |
Insulation Resistance (Min. MΩ)(Initial) | 1000 |
Dielectric Strength | 150V AC for 1min. |
Contact Resistance (M&Omega: Max.) | 40 |
Insertion and Removal Life (Times) | 50 |
Packing Quantity | EMBOSSED TAPE AND PLASTIC REEL |
Packing Quantity; Inner Carton (Pcs.) | 3,000 pieces (1-reel) |
Packing Quantity; Outer Carton (Pcs.) | 6,000 pieces |
Piece Type | 2 Pieces type (Socket) |
Stock check
AXF5G3012
What's New
Stay up to date
Latest Videos