Specifications

Specifications table for model AXF5G3022
ItemPerformance characteristics
Socket/<br>HeaderSocket
Number of Pins30
Mated Height (mm)2.5mm/3.0mm
Family Name (Head of Product No.)AXF5
TypeBOARD-TO-FPC
ApplicationsDSC, Mobile devices, Industrial equipment
Terminal Pitch (mm)0.4
Soldering Terminalswith
Positioning Bosseswithout
Body Length (mm)8.70
Body Height (mm)2.45
Short Width 3.60
Recommended PC Board Pattern Width (mm)4.20
Molded Portion Material LCP resin (UL94V-0)
Contact and Post MaterialCopper alloy
Surface Treatment Material Base: Ni plating Surface: Au plating
Rated Current1.0 A/pin contact x 10 pin contacts (as power contact)
0.5 A/pin contact (as signal contact)
(Max. 12 A at total pin contacts)
Insulation Resistance (Min. M&Omega;)(Initial)1000
Dielectric Strength150V AC for 1min.
Contact Resistance (M&Omega: Max.)40
Insertion and Removal Life (Times)50
Packing QuantityEMBOSSED TAPE AND PLASTIC REEL
Packing Quantity; Inner Carton (Pcs.) 3,000 pieces (1-reel)
Packing Quantity; Outer Carton (Pcs.)6,000 pieces
Piece Type2 Pieces type (Socket)

Stock check

Model image for AXF5G3022

AXF5G3022

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