R-5725/R-5620
Specification
| Item | Performance characteristics |
|---|---|
| Tg (DSC), | 176 °C |
| Tg (TMA), (°C) | 170 °C |
| Tg (DMA), | 210 °C |
| Td (Thermal Decomposition) (°C) | 360 °C |
| T288 (Without Cu) (min) | >120 min |
| T288 (With Cu) (min) | 30 min |
| CTE-Y <Tg (ppm/℃) | 12-14 ppm/°C |
| CTE-Y, <Tg | 13-15 ppm/°C |
| CTE-Z <Tg (ppm/℃) | 35 ppm/°C |
| CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | 265 ppm/°C |
| Thermal Conductivity, (W/m・K) | 0.60 W/m · K |
| Volume Resistivity (MΩ・cm) | 1 x 10⁹ MΩ · cm |
| Surface Resistivity (mΩ) | 1 x 10⁸ MΩ |
| Dielectric Constant (Dk) @ 1Ghz; Test Method IPC-TM-650; Condition C-24/23/50 | 3.8 |
| Dielectric Constant (Dk) @ 10Ghz; Test Method IPC-TM-650; Condition C-24/23/50 | 3.8 |
| Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | |
| Df at 1 GHz | 0.005 |
| Df at 10 GHz | 0.007 |
| Df at 12 GHz | |
| Water Absorption (%) | 0.14% |
| Poisson's Ratio | 0.2 |
| Flexural Warp (MD) (GPa) | 25 GPa |
| Flexural Fill (TD) (GPa) | 23 GPa |
| Peel Strength (1 Oz. Cu) (kN/m) | 1.1 (Cu:RT) kN/m |
| Flammability | 94V-0 |
| Sample Thickness (mm) | 0.8 mm |
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