Molded Underfill (MUF) For flip-chip Chip Scale Packaging (fcCSP)

These transfer molding compounds exhibit superior warpage control even on challenging thin die and coreless package designs. These high-volume, industry-proven products have excellent filling performance to enable large die and narrow interconnect pitch construction.

Standard, high-volume products include CV8710 Series and CV8715 Series. Additional versions available upon request.

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