CSP & FC-CSP
CSP & FC-CSP materials are ultra-thin, enabling thin IC package designs for space-constrained applications
The low CTE property, combined with Panasonic low-stress technology, means reduced warpage which ultimately yields higher operational reliability.
CSP & FC-CSP
Part number list
Results 5
| Part No. | Datasheet | Tg (DMA) (°C) | Dk at 1 GHz | Df at 1 GHz | CTE-X, | CTE α1 Y-axis: Test Method Internal; Condition A (ppm/℃) | Flexural Modulus: Test method JIS C 6481; Condition 25℃ (GPa) | Flexural Modulus: Test method JIS C 6481; Condition 250℃ (GPa) | Peel Strength 1/3 oz (12μm): Test method IPC-TM-650 2.4.8; Condition A (kN/m) | Thickness Line-up (mm) |
|---|---|---|---|---|---|---|---|---|---|---|
220-240 | 4.2 | 0.008 | 4-6 | 4-6 | 28 | - | 0.7 | 0.03-0.2 | ||
220-240 | 4.4 | 0.008 | 6-8 | 6-8 | 24 | - | 0.7 | 0.03-0.2 | ||
270 | 4.5 | 0.015 | 5-7 | 5-7 | 16 | 7-10 | 0.6 | 0.04~0.2 | ||
270 | 4.7 | 0.011 | 9 | 9 | 33 | 18 | 0.9 | 0.04~0.2 | ||
270 | 4.3 | 0.015 | 4.3 | 3-5 | 19 | 5-8 | 0.6 | 0.04~0.2 |
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