Item | Performance characteristics |
---|---|
Tg (DSC) (°C) | 173 |
Tg (TMA), (°C) | 165 |
Tg (DMA) (°C) | 190 |
Td (Thermal Decomposition) (°C) | 350 |
T288 (Without Cu) (min) | >120 |
T288 (With Cu) (min) | 20 |
CTE-X, <Tg (ppm/℃) | 11-13 |
CTE-Y <Tg (ppm/℃) | 13-15 |
CTE-Z <Tg (ppm/℃) | 44 |
CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | 255 |
Thermal Conductivity, (W/m・K) | 0.53 |
Volume Resistivity (MΩ・cm) | 1 x 10⁹ |
Surface Resistivity (mΩ) | 1 x 10⁸ |
Dk at 1 GHz | 4.4 |
Dk at 10 GHz | 4.3 |
Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | - |
Df at 1 GHz | 0.016 |
Df at 10 GHz | 0.020 |
Df at 12 GHz | - |
Water Absorption (%) | 0.12 |
Flexural Warp (MD) (GPa) | 24 |
Flexural Fill (TD) (GPa) | 22 |
Peel Strength (1 Oz. Cu) (kN/m) | 1.5 |
Flammability | 94V-0 |
Sample Thickness (mm) | 0.8mm |
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MEGTRON and XPEDION Series: Connecting to the Future with PCB Materials