Hiper M

Highly Heat-Resistant Multi-Layer Circuit Board Materials

Laminate R-1755M/Prepreg R-1650M

These products offer high heat resistance, low CTE and excellent CAF resistance.

Series image for Hiper M

Hiper M

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Models table for series Hiper M
Part No.DatasheetTg (DSC) (°C) Tg (TMA), (°C)Tg (DMA) (°C) Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-X, CTE-Y CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dk at 1 GHzDk at 10 GHzDielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
R-1755M/R-1650M
153
150
175
355
110
18
11-13
13-15
40
240
0.57
1 x 10⁹ 
1 x 10⁸
4.6
4.4
-
0.014
0.019
-
0.11
24
22
1.5
94V-0
0.8mm

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