R-5515
Specification
| Item | Performance characteristics |
|---|---|
| Tg (DSC) (°C) | - |
| Tg (TMA), (°C) | 170 |
| Tg (DMA) (°C) | 200 |
| Td (Thermal Decomposition) (°C) | 410 |
| T288 (Without Cu) (min) | >120 |
| T288 (With Cu) (min) | >120 |
| CTE-X, <Tg (ppm/℃) | 19-21 |
| CTE-Y <Tg (ppm/℃) | 19-21 |
| CTE-Z <Tg (ppm/℃) | 50 |
| CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | 300 |
| Thermal Conductivity, (W/m・K) | 0.40 |
| Volume Resistivity (MΩ・cm) | 1 x 10⁹ |
| Surface Resistivity (mΩ) | 1 x 10⁸ |
| Dk at 1 GHz | - |
| Dk at 10 GHz | 3.0 |
| Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | 3.1 |
| Df at 1 GHz | - |
| Df at 10 GHz | 0.002 |
| Df at 12 GHz | 0.002 |
| Water Absorption (%) | 0.19 |
| Flexural Warp (MD) (GPa) | 9.7 |
| Flexural Fill (TD) (GPa) | 9.7 |
| Peel Strength (1 Oz. Cu) (kN/m) | 0.6 (Cu:HVLP2 Hoz) |
| Flammability | 94V-0 |
| Sample Thickness (mm) | 0.13mm (0.50mm) |
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