NAND EMC
Granule Epoxy Mold Compounds (EMC) For The Compression Molding Of NAND Memory Packages
These Panasonic products offer excellent warpage control. In-process advantages include good filling characteristics, superior moldability and good wire-sweep performance.
Includes CV8710 Series and CV8714 Series.
Part Number List
Results 2
| Part No. | Datasheet | Tg (TMA) (⁰C ) | CTE-1 (TMA) (ppm/℃) | Flexural Modulus (@25⁰C) (GPa) | Filler Size (Max) (μm) | Mold Shrinkage (%) | Filler Type (FusedSilica/CrystalineSilica/Alumina) | Filler Shape (Spherical/Flake) | Filler Content (in Ash) (% wt) | Filler size (Avg) (μm) | Sprial Flow (cm) | Gelation Time (Sec) | Viscosity (@175⁰C) (Pa Sec) | Specific gravity | CTE-2 (TMA) (ppm/℃) | Flexural Strength(@25⁰C) (MPa) | Flexural Strength(@260⁰C) (MPa) | Flexural Modulus(@260⁰C) (GPa) | Dielectric Constant (1MHz) | Dissipation Factor (1MHz) | Flame Retardant (Yes/No) | Flammability (UL-94) | Thermal Conductivity (W/mK) | Low Alpha Type (Yes/No) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
150 | 9 | 26 | 55 | 0.19 | Fused Silica | Spherial | 88 | 10-14 | 200 | 60 | 13 | 1.99 | 36 | 170 | 25 | 0.9 | 4.0 | 0.016 | No | V-0 | 0.95 | Yes | ||
150 | 9 | 26 | 55 | 0.19 | Fused Silica | Spherial | 88 | 10-14 | 200 | 60 | 13 | 1.99 | 36 | 170 | 25 | 0.9 | 4.0 | 0.010 | No | V-0 | 0.95 | Yes |
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