Item | Performance characteristics |
---|---|
Tg (TMA) (⁰C ) | 150 |
CTE-1 (TMA) (ppm/℃) | 9 |
Flexural Modulus (@25⁰C) (GPa) | 26 |
Filler Size (Max) (μm) | 55 |
Mold Shrinkage (%) | 0.19 |
Filler Type (FusedSilica/CrystalineSilica/Alumina) | Fused Silica |
Filler Shape (Spherical/Flake) | Spherial |
Filler Content (in Ash) (% wt) | 88 |
Filler size (Avg) (μm) | 10-14 |
Sprial Flow (cm) | 200 |
Gelation Time (Sec) | 60 |
Viscosity (@175⁰C) (Pa Sec) | 13 |
Specific gravity | 1.99 |
CTE-2 (TMA) (ppm/℃) | 36 |
Flexural Strength(@25⁰C) (MPa) | 170 |
Flexural Strength(@260⁰C) (MPa) | 25 |
Flexural Modulus(@260⁰C) (GPa) | 0.9 |
Dielectric Constant (1MHz) | 4.0 |
Dissipation Factor (1MHz) | 0.016 |
Flame Retardant (Yes/No) | No |
Flammability (UL-94) | V-0 |
Thermal Conductivity (W/mK) | 0.95 |
Low Alpha Type (Yes/No) | Yes |
MEGTRON and XPEDION Series: Connecting to the Future with PCB Materials