PhotoMOS RF SSOP 1 Form A CxR3

Panasonic's PhotoMOS^® RF SSOP 1 Form A are characterized by their high performance and are adequate for small footprint equipment. With RF SSOP 1 Form A arrangement, these Semiconductor relays are ideal for measuring equipment such as IC, ATE equipment, semiconductor performance boards, function testers, telecommunications, and more. These devices are equipped with a low capacitance Typ. 1.1pF and On-Resistance Typ. 2.8Ω coupled with its miniature SSOP package size at 20V for space savings and high-density mounting.

Features and Benefits

Miniature SSOP Package
Load Voltage: 20 V
Low C×R (C×R3)

Applications

Measuring and Testing Equipment
Telecommunication Equipment

PhotoMOS RF SSOP 1 Form A CxR3

Part number list

Results 3

Models table for series PhotoMOS RF SSOP 1 Form A CxR3
Part No.	Package	Voltage Type	Load Voltage [ V_L ] (V_L)	Continuous Load Current (I_L)	I/O Isolation Voltage (V_iso)	Packing Quantity	Product Name	Type	LED Forward Current (I_F)	LED Reverse Voltage (V_R)	Peak Forward Current (I_FP)	Power Dissipation (P_in)	Peak Load Current (I_peak)	Power Dissipation (P_out)	Total Power Dissipation (P_t)	Ambient Temperature: Operating (T_opr)	Ambient Temperature: Storage (T_stg)	LED Operate Current (Typical)	LED Operate Current (Maximum)	LED Turn Off Current (Minimum)	LED Turn Off Current (Typical)	LED Dropout Voltage (Typical) (V_F)	LED Dropout Voltage (Maximum) (V_F)	On Resistance (Typical) (R_on)	On Resistance (Maximum) (R_on)	Output Capacitance (Typical) (C_out)	Output Capacitance (Maximum) (C_out)	Off State Leakage Current (Typical) (I_Leak)	Off State Leakage Current (Maximum) (I_Leak)	Over Current Protection	Turn On Time (Typical)	Turn On Time (Maximum)	Turn Off Time (Typical)	Turn Off Time (Maximum)	I/O Capacitance (Typical) (C_iso)	I/O Capacitance (Maximum) (C_iso)	Initial I/O Isolation Resistance (Minimum) (R_iso)	LED Current (I_F)	Load Voltage (V_L)	Continuous Load Current (I_L)	Terminal Type	Contact Arrangement	Load current	Load Voltage [ V_L ]	Packing quantity 1-reel (pcs.)	Packing quantity Outer carton (pcs.)	Junction temperature (T_j)
AQY221N5V1Y	SSOP	AC/DC	20 V	0.18 A	1,500 Vrms	Tape and reel packing style (1Y)	RF SSOP 1 Form A CxR3	RF	50 mA	5 V	1 A	75 mW	0.3 A	250 mW	300 mW	-40 to +85℃	-40 to +100℃	0.8 mA	3 mA	0.2 mA	0.7 mA	1.35 V	1.5 V	2.8 Ω	4.5 Ω	1.1 pF	1.5 pF	0.01 nA	10nA	Nothing	0.02 ms	0.2 ms	0.01 ms	0.2 ms	0.8 pF	1.5 pF	1,000 M ohm	Min.: 5 mA, Max.: 30 mA	Max.: 10 V	Max.: 0.18 A	Surface-mount terminal	1 Form A	180 mA	20 V	1,000	1,000	125℃
AQY221N5VW	SSOP	AC/DC	20 V	0.18 A	1,500 Vrms	Tape and reel packing style (W)	RF SSOP 1 Form A CxR3	RF	50 mA	5 V	1 A	75 mW	0.3 A	250 mW	300 mW	-40 to +85℃	-40 to +100℃	0.8 mA	3 mA	0.2 mA	0.7 mA	1.35 V	1.5 V	2.8 Ω	4.5 Ω	1.1 pF	1.5 pF	0.01 nA	10nA	Nothing	0.02 ms	0.2 ms	0.01 ms	0.2 ms	0.8 pF	1.5 pF	1,000 M ohm	Min.: 5 mA, Max.: 30 mA	Max.: 10 V	Max.: 0.18 A	Surface-mount terminal	1 Form A	180 mA	20 V	3,500	3,500	125℃
AQY221N5VY	SSOP	AC/DC	20 V	0.18 A	1,500 Vrms	Tape and reel packing style (Y)	RF SSOP 1 Form A CxR3	RF	50 mA	5 V	1 A	75 mW	0.3 A	250 mW	300 mW	-40 to +85℃	-40 to +100℃	0.8 mA	3 mA	0.2 mA	0.7 mA	1.35 V	1.5 V	2.8 Ω	4.5 Ω	1.1 pF	1.5 pF	0.01 nA	10nA	Nothing	0.02 ms	0.2 ms	0.01 ms	0.2 ms	0.8 pF	1.5 pF	1,000 M ohm	Min.: 5 mA, Max.: 30 mA	Max.: 10 V	Max.: 0.18 A	Surface-mount terminal	1 Form A	180 mA	20 V	3,500	3,500	125℃

Models table for series PhotoMOS RF SSOP 1 Form A CxR3
Part No.	Package	Voltage Type	Load Voltage [ V_L ] (V_L)	Continuous Load Current (I_L)	I/O Isolation Voltage (V_iso)	Packing Quantity	Product Name	Type	LED Forward Current (I_F)	LED Reverse Voltage (V_R)	Peak Forward Current (I_FP)	Power Dissipation (P_in)	Peak Load Current (I_peak)	Power Dissipation (P_out)	Total Power Dissipation (P_t)	Ambient Temperature: Operating (T_opr)	Ambient Temperature: Storage (T_stg)	LED Operate Current (Typical)	LED Operate Current (Maximum)	LED Turn Off Current (Minimum)	LED Turn Off Current (Typical)	LED Dropout Voltage (Typical) (V_F)	LED Dropout Voltage (Maximum) (V_F)	On Resistance (Typical) (R_on)	On Resistance (Maximum) (R_on)	Output Capacitance (Typical) (C_out)	Output Capacitance (Maximum) (C_out)	Off State Leakage Current (Typical) (I_Leak)	Off State Leakage Current (Maximum) (I_Leak)	Over Current Protection	Turn On Time (Typical)	Turn On Time (Maximum)	Turn Off Time (Typical)	Turn Off Time (Maximum)	I/O Capacitance (Typical) (C_iso)	I/O Capacitance (Maximum) (C_iso)	Initial I/O Isolation Resistance (Minimum) (R_iso)	LED Current (I_F)	Load Voltage (V_L)	Continuous Load Current (I_L)	Terminal Type	Contact Arrangement	Load current	Load Voltage [ V_L ]	Packing quantity 1-reel (pcs.)	Packing quantity Outer carton (pcs.)	Junction temperature (T_j)
AQY221N5V1Y	SSOP	AC/DC	20 V	0.18 A	1,500 Vrms	Tape and reel packing style (1Y)	RF SSOP 1 Form A CxR3	RF	50 mA	5 V	1 A	75 mW	0.3 A	250 mW	300 mW	-40 to +85℃	-40 to +100℃	0.8 mA	3 mA	0.2 mA	0.7 mA	1.35 V	1.5 V	2.8 Ω	4.5 Ω	1.1 pF	1.5 pF	0.01 nA	10nA	Nothing	0.02 ms	0.2 ms	0.01 ms	0.2 ms	0.8 pF	1.5 pF	1,000 M ohm	Min.: 5 mA, Max.: 30 mA	Max.: 10 V	Max.: 0.18 A	Surface-mount terminal	1 Form A	180 mA	20 V	1,000	1,000	125℃
AQY221N5VW	SSOP	AC/DC	20 V	0.18 A	1,500 Vrms	Tape and reel packing style (W)	RF SSOP 1 Form A CxR3	RF	50 mA	5 V	1 A	75 mW	0.3 A	250 mW	300 mW	-40 to +85℃	-40 to +100℃	0.8 mA	3 mA	0.2 mA	0.7 mA	1.35 V	1.5 V	2.8 Ω	4.5 Ω	1.1 pF	1.5 pF	0.01 nA	10nA	Nothing	0.02 ms	0.2 ms	0.01 ms	0.2 ms	0.8 pF	1.5 pF	1,000 M ohm	Min.: 5 mA, Max.: 30 mA	Max.: 10 V	Max.: 0.18 A	Surface-mount terminal	1 Form A	180 mA	20 V	3,500	3,500	125℃
AQY221N5VY	SSOP	AC/DC	20 V	0.18 A	1,500 Vrms	Tape and reel packing style (Y)	RF SSOP 1 Form A CxR3	RF	50 mA	5 V	1 A	75 mW	0.3 A	250 mW	300 mW	-40 to +85℃	-40 to +100℃	0.8 mA	3 mA	0.2 mA	0.7 mA	1.35 V	1.5 V	2.8 Ω	4.5 Ω	1.1 pF	1.5 pF	0.01 nA	10nA	Nothing	0.02 ms	0.2 ms	0.01 ms	0.2 ms	0.8 pF	1.5 pF	1,000 M ohm	Min.: 5 mA, Max.: 30 mA	Max.: 10 V	Max.: 0.18 A	Surface-mount terminal	1 Form A	180 mA	20 V	3,500	3,500	125℃

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INCREASE RELIABILITY BY CHANGING REED RELAYS TO PHOTOMOS®

The enhancement of electrical components is directly proportional to the growing need for higher-performing Semiconductor test equipment. As components become more diversified in their capabilities, production volumes increase and down-sizing occurs, the demand for higher functioning Relays is required. Discover how long term performance and reliability increases when the most suitable Relay is used.

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