Hiper D

Highly Heat-Resistant Multi-Layer Circuit Board Materials

Laminate R-1755D/Prepreg R-1650D

With a Tg of 163oC (DSC) and excellent CAF resistance, these materials are ideal for harsh usage environments. They are compatible with lead-free soldering processes and offer excellent laminate processability.

Series image for Hiper D

Hiper D

Part number list

Results 1
Models table for series Hiper D
Part No.DatasheetTg (DSC) (°C) Tg (TMA), (°C)Tg (DMA) (°C) Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-X, CTE-Y CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dk at 1 GHzDk at 10 GHzDielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
R-1755D/R-1650D
163
154
185
345
-
15
10-12
12-14
43
236
0.63
1 x 10⁹ 
1 x 10⁸
4.4
-
-
0.016
-
-
0.11
23
21
1.3
94V-0
0.8mm
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