Halogen Free Multi-layer Circuit Board Materials

Used For A Wide Variety Of Applications Particularly In the Automotive And Mobile Industries

R-1566 Laminate/ R-1551 Prepreg

Compatible with mSAP processing.

Series image for Halogen Free Multi-layer Circuit Board Materials

Halogen Free Multi-layer Circuit Board Materials

Part number list

Results 2
Models table for series Halogen Free Multi-layer Circuit Board Materials
Part No.DatasheetTg (DSC) (°C) Tg (TMA), (°C)Tg (DMA) (°C) Td (Thermal Decomposition) (°C) T288 (Without Cu) (min) T288 (With Cu) (min)CTE-X, CTE-Y CTE-Z CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) Thermal Conductivity, (W/m・K) Volume Resistivity (MΩ・cm) Surface Resistivity (mΩ)Dk at 1 GHzDk at 10 GHzDielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50Df at 1 GHzDf at 10 GHzDf at 12 GHzWater Absorption (%)Flexural Warp (MD) (GPa)Flexural Fill (TD) (GPa)Peel Strength (1 Oz. Cu) (kN/m) FlammabilitySample Thickness (mm)
R-1566W
148
145
170
350
＞120
3
11-13
13-15
40
180
0.62

1 x 10⁹ 

1 x 10⁸
4.6
4.6
-
0.010
0.016
-
0.14
24
22
1.8
94V-0
0.8mm
R-1566WN
148
145
170
355
＞120
10
11-13
13-15
40
180
0.62

1 x 10⁹ 

1 x 10⁸
4.6
4.6
-
0.010
0.016
-
0.14
24
22
1.8
94V-0
0.8mm

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