Specifications
| Item | Performance characteristics |
|---|---|
| Tg (DSC) (°C) | - |
| Tg (TMA), (°C) | - |
| Tg (DMA) (°C) | >340 (TPI 240) |
| Td (Thermal Decomposition) (°C) | 577 |
| T288 (Without Cu) (min) | - |
| T288 (With Cu) (min) | - |
| CTE-X, <Tg (ppm/℃) | 18-20 |
| CTE-Y <Tg (ppm/℃) | 16-19 |
| CTE-Z <Tg (ppm/℃) | - |
| CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | - |
| Thermal Conductivity, (W/m・K) | 0.16 |
| Volume Resistivity (MΩ・cm) | - |
| Surface Resistivity (mΩ) | - |
| Dk at 1 GHz | 3.2 |
| Dk at 10 GHz | 3.2 Test method：Cavity resonance |
| Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | 3.1(19GHz) |
| Df at 1 GHz | 0.002 |
| Df at 10 GHz | 0.004 Test method：Cavity resonance |
| Df at 12 GHz | 0.003(19GHz) |
| Water Absorption (%) | 0.9 Test method：Internal method |
| Flexural Warp (MD) (GPa) | - |
| Flexural Fill (TD) (GPa) | - |
| Peel Strength (1 Oz. Cu) (kN/m) | 1.3(ED:18μｍ) |
| Flammability | - |
| Sample Thickness (mm) | 0.025ｍｍ |
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R-F770
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BEYOLEX™ Stretchable Circuit Materials
