Item | Performance characteristics |
---|---|
Tg (DSC) (°C) | - |
Tg (TMA), (°C) | - |
Tg (DMA) (°C) | >340 (TPI 240) |
Td (Thermal Decomposition) (°C) | 577 |
T288 (Without Cu) (min) | - |
T288 (With Cu) (min) | - |
CTE-X, | 18-20 |
CTE-Y, | 16-19 |
CTE-Z | - |
CTE α2 Z-axis: Test Method IPC-TM-650 2.4.24; Condition A (ppm/℃) | - |
Thermal Conductivity, (W/m・K) | 0.16 |
Volume Resistivity (MΩ・cm) | - |
Surface Resistivity (mΩ) | - |
Dk at 1 GHz | 3.2 |
Dk at 10 GHz | 3.2 Test method:Cavity resonance |
Dielectric Constant (Dk) @ 12Ghz; Test Method Balanced-type Circular Disk Resonator; Condition C-24/23/50 | 3.1(19GHz) |
Df at 1 GHz | 0.002 |
Df at 10 GHz | 0.004 Test method:Cavity resonance |
Df at 12 GHz | 0.003(19GHz) |
Water Absorption (%) | 0.9 Test method:Internal method |
Flexural Warp (MD) (GPa) | - |
Flexural Fill (TD) (GPa) | - |
Peel Strength (1 Oz. Cu) (kN/m) | 1.3(ED:18μm) |
Flammability | - |
Sample Thickness (mm) | 0.025mm |
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MEGTRON and XPEDION Series: Connecting to the Future with PCB Materials